Belaidžio ryšio siųstuvų-imtuvų susiderinimo būdų analizė / Analysis of self tuning methods for direct conversion transceivers


Integrated circuit fabrication technological processes affect error of transceiver’s components, thus aims to minimize such deviation. This paper analyzes modern wireless transceiver calibration methods: feedforward, feedback, hybrid and indirect. Main parameters to calibrate are: I/Q gain and phase imbalance, DC offset and second order input intercept point. For first time, relations between transceiver parameters, parameters to be calibrated and calibration methods are proposed.


Integrinių grandynų gamybos technologinių procesų paklaidos didina daugiastandarčių siųstuvų-imtuvų komponentų parametrų sklaidą ir blogina jų veiką, tad siekiama komponentų verčių nuokrypius kompensuoti. Pagrindiniai derinami parametrai yra tokie: siųstuvo ir imtuvo kvadratūrinių kanalų nuolatinės dedamosios, amplitudės ir fazės poslinkiai, antrosios eilės iškraipymai. Darbe išanalizuoti žinomi daugiastandarčių belaidžio ryšio siųstuvų-imtuvų derinimo būdai, jie suskirstyti į tiesioginio, netiesioginio ir grįžtamojo ryšio bei mišriuosius būdus. Ištirtos analoginės ir skaitmeninės modernių siųstuvų-imtuvų derinimo sistemos, atlikta jų privalumų ir trūkumų bei modernioms belaidžio ryšio sistemoms aktualių derinimo parametrų analizė.

Reikšminiai žodžiai: integrinis grandynas, daugiastandartis siųstuvas-imtuvas, derinimosi sistema, KMOP.

Keyword : integrated circuit, transceiver, tuning system, CMOS

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